bn.png

High-precision solder paste thickness detector
Effectively detect and control defects in the solder paste printing process
Height, area, volume, short circuit, position
Issues such as missing prints, insufficient solder, misalignment, and collapse

Feature: ◆ Easy to operate and learn
Online operation control of multiple machines
Innovative online non-stop debugging mode
Programmable digital fringe grating 3D measurement, high-precision screw guide rail platform
Industry 4.0 multi-machine remote control management system SPC statistical analysis data

application field
The product is widely used in various electronic fields such as aviation, smartphones, automobile manufacturing, tablet computers, FPC, digital home appliances, display screens, backlighting, LEDs, medical equipment, MINILEDs, semiconductors, industrial control, and more.

Request A Quote 

PRODUCT DESCRIPTION

SPC data collection and analysis

SPC real-time data statistics and report generation;

Real-time statistics of process data and establishment of a robust database

Analyze various important data and provide users with powerful insights

Quality control support for force, complete and diverse SPC tools, and

Support data output in different formats

4529ba47-0040-4fd2-ab37-5fb542e79b3c

Barcode scanning/database connection

Diversified barcode recognition functions,

You can choose between the main camera or an external one

Barcode reading for both one-dimensional and two-dimensional codes,

And support the function of manually inputting barcodes

8d8823ee-0f63-43c8-b9f3-04ec58d79a85

3D detection principle

Project stripes of light at a specific angle and collect projected images from cameras at different angles; by measuring the height and area values within each pixel range, and multiplying the two, precise calculations can be made for each within the measurement range, thus obtaining the average height of each point, as well as various data such as area, volume, and height

2b5b0b09-f35f-441b-b680-29335c841735


3D SPI High-precision Solder Paste Thickness Detector Parameter Table

Equipment detection capability parameters Item Parameter

Equipment model: S8060

PCB thickness range: 0.5-6mm

Adapt to the smallest components. Standard configuration: 0201 / Optional configuration: 01005

PCB size range: Max 510*460mm

Inspection items: height, area, volume, short circuit, position, missing printing, insufficient solder, offset, collapse, etc

PCB warpage ≤5mm (with fixture assistance to correct deformation) can eliminate the impact of PCB deformation



Optical system Camera pixel 5 million color high-speed industrial camera

Optical resolution: Standard configuration 15um

Light source: Programmable electronic grating + RGB light source

Detection speed: 0.3s/FOV

Height detection "Calibration Module" 1um (using standard calibration block)

Minimum measurable tin pad spacing: 150um


Platform, motion mechanism, screw rod guide rail

Analysis accuracy: 2um

Moving speed: 800mm/sec



Conveyor system, track width adjustment, automatic width adjustment, manual width adjustment

Circuit board conveying/fixing: Belt conveyor + pneumatic clamping plate

Conveying direction Standard configuration: left to right (right to left optional)

Part height limits: Upper end: 30mm, Lower end: 50mm, Side edges: 3mm

Computer configuration: Computer configuration, system: 64GB RAM/i7/1TB HDD/256GB SSD/Windows 10 64-bit


Equipment requirements: Equipment dimensions (W*D*H) 1060mm* 1290mm* 1960mm

Equipment weight: 650KG

Power supply and air pressure: 220V, 50~60Hz, 2kva, 5kg/cm


Software part: Programming mode, data output mode. Supports Gerber Format (274X), ODB++ Histogram, S-

bar&R- Chart,CP&Cpk %Gage R&R

Optional Features: Offline programming, external barcode scanner, SPC data center, UPS uninterruptible power supply, shared badmark for pick-and-place machine

Device services, software upgrade services, and lifetime free upgrades

Customized Service: Tailored Features


CONTACT US

Submit